R5-ND2 DeviceNet INTERFACE MODULE

Detail

·Some details are not shown. Please refer to specification sheets for all information.

R5-ND2

Remote I/O R5 Series

DeviceNet INTERFACE MODULE
(for 32-point analog signals)

MODEL: R5-ND2[1]

ORDERING INFORMATION
• Code number: R5-ND2[1]
Specify a code from below for [1].
 (e.g. R5-ND2/Q)
• Specify the specification for option code /Q
 (e.g. /C01)

[1] OPTIONS
blank: none
/Q: With options (specify the specification)

SPECIFICATIONS OF OPTION: Q
COATING (For the detail, refer to M-System's web site.)
/C01: Silicone coating
/C02: Polyurethane coating
/C03: Rubber coating

RELATED PRODUCTS
• PC configurator software (model: R5CON)
• EDS file
The EDS file and configurator software are downloadable at M-System’s web site.
A dedicated cable is required to connect the module to the PC.  Please refer to the internet software download site or the users manual for the PC configurator for applicable cable types.

GENERAL SPECIFICATIONS
Connection
  DeviceNet: Euro type connector terminal
  (Applicable wire size: 0.2 – 2.5 mm² (AWG 24 to 12), stripped length 7 mm)
  Internal bus: Via the Installation Base (model: R5-BS)
  Internal power: Via the base (model: R5-BS)
Isolation: DeviceNet to internal bus or internal power
Data allocation: Fixed to Mode 2

DeviceNet COMMUNICATION
Transmission cable: Approved for DeviceNet
Node address setting: DIP switch; 00 – 63
Baud rate: 125 kbps, 250 kbps, 500 kbps DIP switch
NS (Network Status) indicator: Bi-color (green/red) LED
indicates status of the communication link.
MS (Module Status) indicator: Bi-color (green/red) LED
indicates device status.
Data allocation: 32 words for input data 35 words for output
data

INSTALLATION
Supply voltage to network: 11 – 25 V DC supplied through the network terminal block
Supply current to network: 50 mA max.
Operating temperature: -10 to +55°C (14 to 131°F)
Operating humidity: 30 to 90 %RH (non-condensing)
Atmosphere: No corrosive gas or heavy dust
Mounting: Installation Base (model: R5-BS)
Weight: 100 g (3.53 oz)

PERFORMANCE
Insulation resistance: ≥ 100 MΩ with 500 V DC
Dielectric strength: 2000 V AC @ 1 minute (DeviceNet to internal bus or internal power)

STANDARDS & APPROVALS
EU conformity:
EMC Directive 
  EMI EN 61000-6-4
  EMS EN 61000-6-2
RoHS Directive
  EN 50581

EXTERNAL VIEW

TRANSMISSION DATA DESCRIPTIONS
The DIP SW located at the side of the module must be turned OFF.
Data Allogcation Mode 2 is used for the R5-ND2. In this mode, two (2) words are assigned for one I/O module regardless of whether the second word area is required or not. For example, discrete I/O modules require only one (1) word, but two (2) words are automatically assigned to these modules.
■ I/O CAPACITY
A maximum of 16 I/O modules can be mounted per node.

I/O DATA DESCRIPTIONS
The data allocations for typical I/O modules are shown below.
Refer to the manual for each module for detailed data allocations.

EXTERNAL DIMENSIONS unit: mm (inch)

SCHEMATIC CIRCUITRY & CONNECTION DIAGRAM

M-System Co., Ltd.