DeviceNet INTERFACE MODULE R6-ND1

Detail

R6-ND1

Remote I/O R6 Series

DeviceNet INTERFACE MODULE

Functions & Features
• Free combination of analog and discrete I/O
• Direct sensor inputs
• Space-saving
• Low power consumption
Typical Applications
• Remote I/O for DCS and PLC
 

MODEL: R6-ND1[1]

ORDERING INFORMATION
• Code number: R6-ND1[1]
Specify a code from below for [1].
  (e.g. R6-ND1/Q)
• Specify the specification for option code /Q
  (e.g. /C01)

[1] OPTIONS
blank: none
/Q: With options (specify the specification)

SPECIFICATIONS OF OPTION: Q
COATING (For the detail, refer to M-System's web site.)
/C01: Silicone coating
/C02: Polyurethane coating

RELATED PRODUCTS
• EDS file
(downloadable at M-System’s web site.)

GENERAL SPECIFICATIONS
Connection
  DeviceNet: Euro type connector terminal
  (applicable wire size: 0.2 to 2.5 mm², stripped length
  7 mm)
  Internal bus: Via the Installation Base (model: R6x-BS)
  Internal power: Via the Installation Base (model: R6x-BS)
Max. number of I/O modules: 32 (analog 64 points)
Isolation: DeviceNet to internal bus or internal power
Data allocation: Mode 1 or 2 set with the side DIP switch

DeviceNet COMMUNICATION
Transmission cable: Approved for DeviceNet
I/O data area size: Input and output data area size set with side DIP SW
Node address setting: DIP switch; 00 – 63
Baud rate setting: DIP switch
125 kbps, 250 kbps, 500 kbps
NS (Network Status) indicator: Bi-color (green/red) LED
indicates status of the communication link.
MS (Module Status) indicator: Bi-color (green/red) LED
indicates device status.

INSTALLATION
Supply voltage to network: 11 – 25 V DC supplied through the network terminal block
Supply current to network: 50 mA max.
Operating temperature: -10 to +55°C (14 to 131°F)
Operating humidity: 30 to 90 %RH (non-condensing)
Atmosphere: No corrosive gas or heavy dust
Mounting: Installation Base (model: R6x-BS)
Weight: 100 g (3.53 oz)

PERFORMANCE
Insulation resistance: ≥ 100 MΩ with 500 V DC
Dielectric strength: 2000 V AC @ 1 minute (DeviceNet to internal bus or internal power)

STANDARDS & APPROVALS
EU conformity:
EMC Directive 
  EMI EN 61000-6-4
  EMS EN 61000-6-2
RoHS Directive
  EN 50581

EXTERNAL VIEW

TRANSMISSION DATA DESCRIPTIONS
The DIP SW located at the side of the module switches the unit’s data allocation mode.
In the Data Allocation Mode 1, one (1) word is assigned per module. The second channel of analog I/O modules cannot be used.
In the Data Allocation Mode 2, two (2) words are assigned per module regardless of whether the second word area is required or not, even for discrete I/O modules that require one (1) word.
A maximum of 32 I/O modules can be mounted per node.

I/O DATA DESCRIPTIONS

EXTERNAL DIMENSIONS unit: mm (inch)

SCHEMATIC CIRCUITRY & CONNECTION DIAGRAM

M-System Co., Ltd.